Conference Electronics Production
“Soldering in electronics manufacturing”
Conference on 18.05. online, 13.+14.10. in Wertheim at Ersa
On May 18, the technical conference series “Soldering in Electronics Manufacturing” started as an online event due to the situation. The face-to-face event, jointly organized by several companies, will take place on October 13 and 14 at the Ersa Training and Seminar Center.
The interest in the online event, which provided compact information on the topics of the symposium, was enormous – a total of 115 participants dialed in. To kick things off, Dr. Hans Bell, a long-standing expert in the field of packaging technology, gave a brief overview of soldering technologies, presented holistic processes and addressed challenges in reflow soldering – above all the increasing miniaturization of passive and active components and the growing complexity of the internal structure of the components. Kurt-Jürgen Lang, Senior Key Expert Processing at Osram Opto Semiconductors, focused on essential materials of the assembly with “Solderability of SMD components” and presented package trends and current chip designs such as “bottom only terminations”. In addition to solder heat resistance vs. solderability, reflow profiling and solder pad as well as paste design, the fundamental topics in October will be the properties of base materials and solder resist (speaker: KSG GmbH) and the characterization of PCB surfaces (speaker: Fraunhofer IZM).
The third block of topics, “Properties of solders”, was presented by Dipl.-Ing. (FH) Günter Grossmann, Head of the Center for Industrial Electronics and Reliability Technology at Empa in Dübendorf (Switzerland) – covering topics such as: Metallurgy (structure, soldering process), solder pastes and fluxes, stencil printing and reliability.
Finally, Dipl.-Ing. (FH) Jürgen Friedrich, Head of Application Technology at Ersa, presented the topic block “Soldering with liquid solder” – from hand and repair soldering to energy transfer as well as thermal process windows in wave and selective soldering. In October, the two-day presence symposium will then go into depth.
