Rework-Evolution
Ersa Rework Evolution!
Automatic – flexible – reproducible
From fine-pitch components such as µBGA and 01005 miniature devices to large components – Ersa Rework Systems have continuously adapted to the changes in electronics manufacturing. At productronica 2019, Ersa presented three hybrid rework systems that have one thing in common: precise, reliable, high-quality processing of electronic assemblies.
Since the introduction of the first patented medium wave IR rework system in 1997, several thousand rework systems and stations have been installed worldwide. Today they are used in electronics manufacturing, product development, analysis and testing. Wherever they are used, they maintain the added value of the customers. With the hybrid rework systems HR 500, HR 550 XL and HR 600/3P Ersa is pushing the continuous development of technology for the benefit of the users. The constant new developments in electronics create new soldering and repair tasks almost daily. Drivers are the advancing miniaturization (chips of size 01005) and new techniques such as 5G with extremely powerful and partly very large components (ball grid arrays with 100 x 100 mm edge length). Here, the individually adapted preheating of the assembly is gaining in importance in order to avoid distortion of the board.
Furthermore, it is apparent that “zero defect” is not always achievable in production. Despite the best equipment and highly qualified personnel, a variety of influencing factors lead to errors that have to be corrected, for example, when the product is started up again. To cover the widest possible range of applications, the flexibility of the rework systems is an important parameter. This applies to desoldering and soldering processes, which must be as universal as possible and without expensive accessories, as well as to component placement. In classical rework, components such as BGA, MLF or QFP are desoldered and replaced by new ones. During service work, defective assemblies are partially put into function by simple resoldering. SMT connectors and sockets as well as special designs are challenging, but can usually be safely processed.
More developments, more systems
The development departments of many well-known manufacturers use Ersa Rework systems for prototyping. New housing shapes or components are assembled and soldered for the first time. Even more frequently, first assemblies are fitted with newly programmed or modified components. Even more exotic areas of analytics or technical forensics use rework systems. Cross-exchanges during troubleshooting are just as common as the desoldering of memory components from mobile phones or notebooks to analyze the stored data.
It is only logical that Ersa is expanding its product portfolio and providing customers with the appropriate systems. The ideal field of application for the devices may well overlap. For example, BGA repair tasks can be solved with the same quality as with the HR 600/2 and HR 550. The current rework spectrum covers practically all SMD components as they are installed in smartphones, notebooks, industrial controls or powerful server boards. The customer decides on the basis of the soldering task and requirements, which Ersa system is best suited.
High-quality soldering and desoldering processes
Ersa hybrid heating technology has been established on the market for many years. The energy input for soldering is a combination of medium wave infrared radiation and a convection component. With this technology, assemblies are heated gently and homogeneously. The sensor-guided, closed control loop guarantees precise and repeatable soldering and desoldering processes. External influences are automatically controlled and largely compensated. The Ersa heating technology does not require component-specific nozzles and is therefore very universally applicable, no additional costs or waiting times are incurred. Damage to surrounding components by hot gases is excluded, miniature components are not blown away.
The continuous development of the technology is reflected in even more efficient heating systems and in the preparation of the connection surfaces. The component connections – for example with BGA, QFP – are automatically dipped in flux or solder paste before soldering. Alternatively, components such as LGA or MLF can also be printed with paste. This produces defined solder joints that are on a par with production quality. In addition to the desoldering and soldering processes, precise placement is an elementary process step in the case of highly polar components. Only slight deviations from the ideal position are permitted. Ersa systems feature automatic placement with image processing or optical systems with excellent image quality for manual alignment. In both cases the operating software provides practical support for the user while the component is being aligned.
HRSoft 2: Uniform platform for new rework systems
The software package for rework systems was also further developed and technologically updated. The current HR Soft 2 provides a uniform platform for all new rework systems. Clear operation, clear user guidance are just as much in focus as the minimal familiarization when using different Ersa devices. New features such as a “minimap” and the “click into the picture” shorten the time needed to find the working position for very large assemblies. A scaled crosshair helps to grip components exactly in the middle during the desoldering process. In HR Soft 2, all process steps and system statuses are transparent to the user at all times and are comprehensively documented. The archiving of process data allows the user to see at any time which parameters were used to process an assembly. Of course, HR Soft 2 also provides the basis for connecting the devices to Manufacturing Execution Systems (MES).
In the meantime, many manufacturers have recognized that rework and repair are part of the manufacturing process. Therefore, all process data associated with these steps are just as important as the data of the line production. The connection of rework systems to the existing MES infrastructure is therefore a logical consequence. HR Soft 2 can provide the process parameters required by the customer and establish the link to the respective order.
Hybrid rework family at its best
The best-selling Ersa IR 550 and the hybrid rework stations HR 100 and HR 200 have been on the market for many years and have a large fan base. Likewise, the first automated rework system HR 600/2 and the HR 550 are already firm favourites in the industry. The hybrid rework system HR 600 XL is causing a sensation as it features the most innovative heating technology currently available with its large IR matrix underheater. All heating zones of the matrix can be individually adjusted and the assembly can thus be ideally preheated. The system – equipped with an extra large heating head – allows the automatic repair of very large PCBs up to 625 x 625 mm with component sizes up to approx. 120 x 120 mm.
The latest members of the Ersa rework family for component repair are characterized by technologically interesting aspects in the field of heating and placement technology and now offer customers even more choice. For example, the HR 500 semi-automatic system is tailored to budget-oriented users. It allows the flexible repair of standard assemblies up to 380 x 300 mm and component sizes of 50 x 50 mm. The big brother is the HR 550 XL rework system, which is also semi-automatic – a performance package with eight underheater heating zones and motorized X/Y fine adjustment as well as motorized component rotation. The system is suitable for industrial and power electronics as well as large format boards up to 530 x 530 mm. In the semi-automatic systems, component alignment is carried out by the operator using a vision box. In the fully automatic systems, image processing calculates the set-down position and an axis system places the component.
If, on the other hand, the highest precision is required from a rework system, the automatic HR 600/3P is the best choice. The rework system enables the automatic repair of fine pitch components such as µBGA and smallest chip components of size 01005. The high-precision axis system and 5-MP cameras offer the most accurate desoldering and placement technology currently available in the rework process.