Hybrid Rework System HR 550
Ersa Hybrid Rework System HR 550 – High Performance Rework for Pros!
The repair of printed circuit board assemblies – particularly the repair of high-pinout SMD components – has always been considered difficult. But rework systems have substantially raised the level of reliability and reproducibility. Now, with the introduction of the Ersa HR 550 Hybrid Rework System, the process of board repair has left its niche existence!
While the challenges in board repair have not changed, the tolerance window for permissible deviations has become smaller. If the temperatures on the board are too high, the board or the components may get damaged. Everyone who had to remove a BGA without proper tooling has made this painful experience. The high process temperature (230–240 °C) of lead-free solders reduces the tolerance range for the maximum permissible component temperature to typically 260 °C. A modern rework system must be able to meet this requirement, yet further miniaturization and new package designs are raising new questions: How can new component shapes be handled, how can fluxes and solder pastes be applied? Answer: with the highest flexibility and modularity in the design of the system.
Controlled Heating Power
In the HR 550, the board will be gently and homogeneously heated. Process monitoring takes place in a closed loop control circuit. For this, contact sensors and a digital IR sensor are available. With a 1,500 W hybrid high performance heating element, SMT components up to a size of 70 x 70 mm may be processed. The combination of IR radiation with a defined proportion of convection ensures a highly dynamic heating process.
The 3-zone lower heating unit with medium wave length IR emitters delivering 2,400 W evenly heats the complete board. The nominal profile defines the heat distribution across the board. Light and low mass PCBs can thus be processed with a “balance” different from that of heavy boards. An important criterion for many customers: The first and the nthboard repaired have to show the same excellent results. The process control of the HR 550 permanently monitors the temperatures of components and preheaters – this feature delivers a previously not achieved level of reliability and repeatability of the solder process.
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Very precise component placement
The precise placement of the components plays a decisive role in determining whether the repair will be a success or a failure. For high pinout miniaturized components with hidden connections (bottom terminal component, BTC), an imprecise placement often is the cause for a defective solder connection (bridging, open joints). The HR 550 offers intelligent technical solutions to overcome this: The high-resolution 5 MP camera with its preceding special optic offers the user high-contrast images of the chips, from chip size 01005 up to components of 70 x 70 mm. A unique feature of the HR 550 is the optical shift to two different zoom levels for large and for small components.
Under the term “Computer Aided Placement” (CAP), all functions supporting the user during placement are summarized and made available via image processing. When components are being aligned, a life image will show, in virtual colors, the connections of components (red) and the terminal pads (green). Optimal superimposition of joints and pads is recognized by blue coloring. Another tool is the digitally split optic which assists when aligning components such as large QFPs. With the rotational adjustment and the x-y micrometer adjustment features, each component can be placed precisely on its designated pad.
Of particular advantage: the operating controls are conveniently placed at the front of the system. Components are removed and placed with a highly precise vacuum pipette integrated into the heating head.
Process guidance with new software platform
The HR 550 features the newly developed software platform HRSoft 2, which impresses by its clarity and functional arrangement – all process steps of the procedure are logically displayed and can easily be configured and executed. The operator prompting (Enhanced Visual Assistant – EVA) takes the user through the rework routine, from the selection of a profile for desoldering through the subsequent alignment and placement of a new component, right up to the soldering process.
The application of solder paste on the component by using a printing template or the flux dip-in process is electively supported. All process steps and the associated parameters are documented, so full traceability of all rework processes is ensured. Conclusion: The HR 550 is ideal for all those users, who have high demands on precision and process safety when reworking their board assemblies. It is the ideal tool with which to make the repair of board assemblies a stable and manageable process!